Server Farms Get WayCool

1U or blade servers represent a megatrend in servers for more distributed computing environments such as corporate networks, intranets and data centers. Installing a rack of clustered blade servers in place of a single, monolithic piece of server hardware is by no means opting out of Moore's Law. They are simply choosing to take advantage of it in a different way.

Higher quantities of simpler but denser blade servers simply distribute the computing power of the data center in a more flexible, yet equally power dense, configuration. 1U and blade servers require advanced cooling solutions that are thin, powerful heat transfer systems that can integrate CPU, chipset and memory cooling in one system.

Waytronx™ WayCool™ technology's hybrid (liquid + air) cooling architecture is uniquely suited to the severe form factor and heat removal needs of highly dense server environments. WayCool™ Mesh enables unique form factors, including very thin, single slot cooling with hundreds of watts of capacity. WayCool™ hermetically-sealed Pumps require no maintenance.  It is also worth considering how rapidly a cooling solution can draw heat way from the source. The lower the temperature inside the server, the more efficiently the microprocessors can operate. This, in turn, leads to less energy consumption, while maintaining maximum performance.

Waytronx WayCool architecture has been designed specifically to address the extreme power density and cooling requirements of server computers and blade servers.  WayCool Carbon technology conductively removes heat at rates up to four times that of typical copper plate heat conductors.  WayCool Mesh, WayCoolant™ Liquid Coolant, and WayCool hermetically sealed Pumps combine with traditional fan cooling to provide a hybrid liquid-air cooling architecture of unprecedented convenience and cooling capability, enabled with a flexible form factor, thanks to the WayCool Hybrid Mesh. 

In addition, the Waytronx WayFast™ i/o and power delivery fabric is designed to enable massively parallel chipset i/o in future 3D packaging.

Server system developers can contact our development team to find out more about WayCool and WayFast technologies in the enterprise at (866) WAYTRNX or write to us at engineering@waytronx.com.